{"id":240,"date":"2025-07-07T01:24:28","date_gmt":"2025-07-07T01:24:28","guid":{"rendered":"https:\/\/www.phaseglobaldatascientific.com\/?p=240"},"modified":"2025-07-18T22:12:20","modified_gmt":"2025-07-18T22:12:20","slug":"device-diagnostics-harness","status":"publish","type":"post","link":"https:\/\/www.phaseglobaldatascientific.com\/index.php\/2025\/07\/07\/device-diagnostics-harness\/","title":{"rendered":"Device Diagnostics Harness"},"content":{"rendered":"\n<details class=\"wp-block-details is-layout-flow wp-block-details-is-layout-flow\" open><summary>Objectives<\/summary>\n<p><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Device harness firmware for post-assembly-line device quality assurance testing and RMAs<\/li>\n<\/ul>\n<\/details>\n\n\n\n<details class=\"wp-block-details is-layout-flow wp-block-details-is-layout-flow\" open><summary>Existing Challenges<\/summary>\n<p><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Buggy chipsets from China manufacturing<\/li>\n\n\n\n<li>No automated control mechanisms from host<\/li>\n\n\n\n<li>Custom FPGA design and integration details<\/li>\n\n\n\n<li>Mixed chipset architectures. i.e. ARM, PIC, etc.<\/li>\n<\/ul>\n<\/details>\n\n\n\n<details class=\"wp-block-details is-layout-flow wp-block-details-is-layout-flow\" open><summary>Solutions<\/summary>\n<p><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>C++ bespoke firmware for harness controller<\/li>\n\n\n\n<li>Assembly code for functionality chipsets interfaces, i.e. wifi, bluetooth, hid&#8217;s, screen, usb I\/O, etc.<\/li>\n\n\n\n<li>Custom electric network integration<\/li>\n\n\n\n<li>Windows .NET host controller application and utilities<\/li>\n<\/ul>\n<\/details>\n\n\n\n<details class=\"wp-block-details is-layout-flow wp-block-details-is-layout-flow\" open><summary>Benefits<\/summary>\n<p><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Dual-purpose harness for device testing during dev and mass production<\/li>\n\n\n\n<li>In-house code for future feature and fix development<\/li>\n<\/ul>\n<\/details>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":334,"comment_status":"open","ping_status":"open","sticky":false,"template":"single-case-study","format":"standard","meta":{"footnotes":""},"categories":[16,13,8],"tags":[],"class_list":["post-240","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-consumer-electronics","category-defense","category-embedded-engineering"],"_links":{"self":[{"href":"https:\/\/www.phaseglobaldatascientific.com\/index.php\/wp-json\/wp\/v2\/posts\/240","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.phaseglobaldatascientific.com\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.phaseglobaldatascientific.com\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.phaseglobaldatascientific.com\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.phaseglobaldatascientific.com\/index.php\/wp-json\/wp\/v2\/comments?post=240"}],"version-history":[{"count":1,"href":"https:\/\/www.phaseglobaldatascientific.com\/index.php\/wp-json\/wp\/v2\/posts\/240\/revisions"}],"predecessor-version":[{"id":241,"href":"https:\/\/www.phaseglobaldatascientific.com\/index.php\/wp-json\/wp\/v2\/posts\/240\/revisions\/241"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.phaseglobaldatascientific.com\/index.php\/wp-json\/wp\/v2\/media\/334"}],"wp:attachment":[{"href":"https:\/\/www.phaseglobaldatascientific.com\/index.php\/wp-json\/wp\/v2\/media?parent=240"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.phaseglobaldatascientific.com\/index.php\/wp-json\/wp\/v2\/categories?post=240"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.phaseglobaldatascientific.com\/index.php\/wp-json\/wp\/v2\/tags?post=240"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}